Ion Beam Etch and Ion Beam Deposition system
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General Information
- Contract Opportunity Type: Sources Sought (Original)
- Original Published Date: Mar 27, 2023 05:20 pm EDT
- Original Response Date: Apr 11, 2023 05:00 pm EDT
- Inactive Policy: 15 days after response date
- Original Inactive Date:
- Initiative:
- None
Classification
- Original Set Aside:
- Product Service Code:
- NAICS Code:
- 333242 - Semiconductor Machinery Manufacturing
- Place of Performance: Boulder , CO 80305USA
Description
NO SOLICITATION DOCUMENTS EXIST AT THIS TIME
NIST-Boulder has a state-of-the-art research laboratory (the Katharine Blodgett Gebbie Building) to support the most sensitive research done at NIST. Included in this building is a Class 100 microelectronics fabrication facility, called the Boulder Micro-fabrication Facility (BMF). The BMF requires an Ion Beam Etch and Ion Beam Deposition (IBE/IBD) system in order to fabricate its next generation devices. The system must be a vacuum chamber with a load lock that can perform ion beam etching of substrates and deposit materials including but not limited to; Germanium (Ge), Magnesium Fluoride (MgF2), Tantalum Pentoxide (Ta2O5), Silicon Nitride (SiNx), Gold (Au), Copper (Cu), Tantalum (Ta), Silicon (Si), Aluminum (Al) and methane-based diamond-like carbon deposition in a manner that is consistent with methods used for (IBE/IBD) in the semiconductor industry.
In order to meet its research requirements, the BMF requires a system that can process on a substrate with lateral dimensions of a 150 mm SEMI spec wafer and that provides uniform etch and deposition rates.
Minimum Requirements
The tool must provide a deposition uniformity of better than 1.5 % (½ * range/mean) across a substrate with lateral dimensions of a 150 mm SEMI spec wafer that has one SEMI-standard flat at the bottom minus a 5 mm edge exclusion zone around the edge of the wafer and an etch uniformity of better than 2 % (½ * range/mean) across a substrate with lateral dimensions of a 150 mm SEMI spec wafer and one SEMI-standard flat at the bottom minus a 5 mm edge exclusion zone around the edge of the wafer. To meet this criterion, the contractor shall provide documentation of a deployed system, that is the same model in the bid, that can meet these specifications.
NIST is seeking responses from all responsible sources, including large, foreign, and small businesses. Small businesses are defined under the associated NAICS code for this effort, 333242, as those domestic sources with a size standard of 1,500 employees or less. Please include your company’s size classification and socio-economic status in any response to this notice.
Companies that provide equipment that can meet the stated requirements are requested to email a detailed report describing their products to forest.crumpler@nist.gov no later than the response date for this Sources Sought Notice. The report should include achievable specifications and any other information relevant to your product or capabilities.
Attachments/Links
Contact Information
Contracting Office Address
- ACQUISITION MANAGEMENT DIVISION 100 BUREAU DR.
- GAITHERSBURG , MD 20899
- USA
Primary Point of Contact
- Forest Crumpler
- forest.crumpler@nist.gov
Secondary Point of Contact
- Tracy Retterer
- Tracy.retterer@nist.gov
History
- Aug 25, 2023 11:55 pm EDTCombined Synopsis/Solicitation (Original)
- Apr 26, 2023 11:59 pm EDTSources Sought (Original)