Integrated High-Vacuum Atomic Force Microscopy

1. Introduction

The Electrostatics and Surface Physics Laboratory (ESPL) at the NASA Kennedy Space Center (KSC) is looking to procure an integrated high-vacuum atomic force microscopy (AFM) system. The system will be used to measure atomic-level forces of various materials, including adhesion and electrostatic forces. It will also be used to generate topographical maps of different surfaces. This system must follow the requirements as listed in Section 2. The required period of performance is described in Section 3.

2.Technical Requirements

System shall consist of flexure-guided XY scanner, AFM head, multiple sample mount, motorized XY stage, motorized Z stage, motorized focus stage, direct on-axis optics, integrated active vibration isolation, vacuum chamber, high-vacuum controller, vacuum instrument controller, vacuum pumps (dry backing pump, turbomolecular pump), control electronics, AFM software, image analysis software, vacuum manager software, computer, monitors, cabinet, and table.  

System shall use coordinate frame defined by the vendor and use that coordinate frame for compliance to these requirements.

System shall be instrumented to performing AFM, Scanning probe microscopy (SPM), Electrostatic Force Microscopy (EFM), Lateral Force Microscopy (LFM), and Kelvin Probe Force Microscopy (KPFM).

System shall quantitatively measure adhesion forces on a sample.

System shall quantitatively measure surface potential and work function on a sample.

System shall enable adjustment of all software functions and settings.

System shall provide and/or enable scripting by the customer for automating data acquisition.

System shall have a Computer with Windows OS installed to interface with all measurement equipment. 

System shall have a minimum 100 µm x 100 µm x 15 µm X, Y, and Z scan range, respectively.

System shall have no less than 20-bit XYZ positional accuracy.

System shall have no less than 20-bit XYZ positional control.

System shall detect deflection of the cantilever on the AFM Head using the Super Luminescent Diode (SLD) that does not interfere optically.

System shall align the SLD to an accuracy of 5% of the baseline measurement.

System shall be capable of removing the AFM head, verified by customer demonstration.

Vendor shall provide a multi-sample plate with up to five sample plates no smaller than 10 x 10 x 20 mm (X, Y, Z) in volume that is compatible with the system.

Vendor shall provide a single sample plate no smaller than 100 x 100 x 20 mm in volume that is compatible with the system.

System shall enable a sample no less than 8 mm x 10 mm x 20 mm to reach at minimum 250 °C to support AFM imaging.

System shall control sample temperature to within +/- 10 °C.

System shall be capable of monitoring the sample temperature to a minimum resolution of 1 °C.

Sample temperature shall not affect visual or AFM image quality.

System shall be capable of positioning samples to within a 22 mm x 22 mm x 24 mm volume in the XYZ direction, respectively with an accuracy of no greater than 0.08 µm.

System shall have a CCD camera with no less than 5 MP to view samples.

System’s Camera shall have a focal travel range of 11 mm with an accuracy of no worse than 0.1 µm.

System’s Camera shall have a Field of View of 840 µm x 630 µm with a 10 mm x 10 mm pan range.

System shall have software-controllable LED illumination.

System shall be capable of going to 10-5 torr from 760 torr.

Vacuum sensors shall have an accuracy of no greater than +/- 20% of measurement from 10-5 to 10-3 torr, +/- 10% from 10-3 to 100 torr, and +/- 50% from 100 torr to 800 torr.

Systems shall have a vacuum chamber no less than 250 mm x 320 mm x 270 mm.

System shall control vacuum levels to the same resolution as the vacuum sensor measurement.

System shall provide pump-down instructions to the customer at delivery.

System shall dampen floor noise (1 to 200 Hz) to ensure no loss of measurement accuracy.

System shall have at least 17 Digital-Analog Converters (DACs) for signal generation, with at least 2 high-speed 16-bit DACs.

System shall have at least 18 Analog Digital Converters (ADC) for signal acquisition, with at least 4 high-speed 16-bit ADCs.

System shall have 6 digital I/Os in LV-TTL for image frame, line, pixel, cantilever modulation sync, tip bias-modulation sync, and alarm.

System shall have at least 100 Mbps communications with the computer interface.

Vendor shall provide at least 10 pre-mounted contact cantilevers and 10 pre-mounted non-contact cantilevers.

Vendor shall calibrate the AFM cantilever via a thermal vibration method.

3. Period of Performance

Vendor shall deliver the complete system within 4 months of receiving the contract reward.

Vendor shall provide a design data package (including parts list, integrated schematics, manuals, and published drawings) of the complete system within 2 months of receiving the contract award.

Vendor shall provide on-site installation and training of no less than 4 days within 1 month of system delivery.

Vendor shall supply a warranty of no less than 1 year from delivery that includes troubleshoot support, and part replacement and repair.