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Wirebonders

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General Information

  • Contract Opportunity Type: Solicitation (Original)
  • Original Published Date: Oct 19, 2022 09:40 am CDT
  • Original Date Offers Due: Nov 03, 2022 03:00 pm CDT
  • Inactive Policy: Manual
  • Original Inactive Date: Nov 04, 2022
  • Initiative:
    • None

Classification

  • Original Set Aside:
  • Product Service Code: AJ13 - GENERAL SCIENCE & TECHNOLOGY R&D SVCS; GENERAL SCIENCE & TECHNOLOGY; EXPERIMENTAL DEVELOPMENT
  • NAICS Code:
    • 423610 - Electrical Apparatus and Equipment, Wiring Supplies, and Related Equipment Merchant Wholesalers
  • Place of Performance:
    Batavia , IL 60510
    USA

Description

Wire bonder - automatic & manual

Wirebond from a circuit defined on a substrate to PCB board.

The substrate for the circuit will either be Si or Sapphire with typical size in millimeter to centimeter.

The circuit pads to bond could be Au, Al, Nb, or Ta with typical thickness of ~ 100 to 200 nm.

Contact Information

Contracting Office Address

  • Kirk Rd. & Pine St.
  • Batavia , IL 60510
  • USA

Primary Point of Contact

Secondary Point of Contact





History

  • Nov 04, 2022 10:56 pm CDTSolicitation (Original)