PAM SiC Wafers

All Suppliers (organic and Commercial) for Silicon Carbide (SiC) 100 mm N-type substrate and epitaxy wafers for the E-2D aircraft with capabilities and Qualifications of SiC wafers in support of US. Navy and Foreign Military Sales (FMS) customers.  

ISO-TS-16949 Qualified Material Sought:

1. 4H-SiC, N-type, Production, 100mm, 4” off axis, 500um thickness w/notch, Ultra-low MPD, double-side polish, Standard thickness, 4 layer WAFER
2. 4H-SiC, N-type, Production, 100mm, 4” off axis, 500um thickness w/notch, Ultra-low MPD, double-side polish, Standard thickness, 3 layer WAFER

This announcement constitutes a Request for Information (RFI) to identify Offerors for a potential SiC wafer purchase to support US. Navy and FMS. This requirement supports manufacture of components supporting aircraft mission systems. The required services and supplies will provide material to vendor use in the manufacture and packaging of system components.

The Government does not possess the necessary Level 3 technical data/drawing package and machinery required to manufacture SiC wafers used in the manufacture of E-2 Hawkeye aircraft systems. Companies that are capable of meeting and demonstrating this requirement, currently possess or has authorized access to the necessary technical data or have a viable plan to obtain, generate, or otherwise secure the necessary technical data, and can maintain this capability throughout the duration of the effort being solicited are encouraged to respond. Companies may also highlight unique data generation techniques that are currently utilized by your firm or areas where modifications can be performed, or the capability can be provided, without technical data provided by the Government or OEM.  Interested businesses or organic sources shall demonstrate the capability to meet the Government’s required timeline. You may also submit information that demonstrates how you could potentially meet this requirement for future production opportunities.

The E-/C-2 program office plans to utilize these services and supplies to support the E-2D Advanced Hawkeye (AHE) aircraft during its life cycle.

The Government will provide RDT&E, APN-5, FMS and OM&N funding where required to support these efforts. The vendor will complete all projects, engineering and logistics required under this requirement needed to support the E-2D AHE aircraft SiC wafer purchase. Interested vendors or organic sources must meet pre-qualification requirements in order to be eligible for consideration. This is NOT a Request for Proposal (RFP). Firms that can meet the USN’s requirement in the timelines identified above are encouraged to identify themselves.

Vendors interested in responding to the RFI shall provide a one to two page overview statement addressing the following: 1) Brief statement of interest/capabilities; 2) Any other information at vendor discretion such as catalogs, drawings/illustrations, technical manuals, training description/material, pricing, testing documentation, brochures and/or any other documentation that describes the capabilities, interfaces and specifications; 3) Respondents should identify any Government customer who has procured these services that meet the requirements and provide customer point of contact, including a telephone number, e-mail address or web site.  Responses may be submitted electronically to the email address provided below.  Responses are requested by TBD Earliest possible response is encouraged.  Responses will be reviewed and additional information may be requested from individual vendors if desired by the Government.

This RFI does not constitute a commitment from the Government to issue a solicitation, make an award or awards, or be responsible for any monies expended by any interested party in support of the effort described above.  The Government reserves the right to review and use the data submitted at its own discretion.  Upon request, the Government will protect proprietary information from unwanted disclosure.  Any such requests shall be submitted with the statement of capabilities.